Multi-layered flexible bus bar

Abstract

A flexible bus bar system for connecting printed circuit boards (PCBs), especially suited for high-power applications. The bus bar is constructed from multiple stacked thin sheets of conductive material, imparting flexibility and reducing mechanical stress on connected PCBs in applications prone to shock and/or vibration, such as electric vehicle power systems. The sheets may be laser-cut, optionally enabling formation of intricate geometries and/or integrated direct mounting apertures, potentially eliminating the need for additional connectors or crimps. One or more radiused curves are introduced into a central portion of the bus bar, holding the layers in alignment and providing flexibility and/or elasticity. The assembly may be reinforced with an adhesive-backed heat shrink. Methods of fabrication are also disclosed.