The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Apr. 05, 2023
Te Connectivity Solutions Gmbh, Schaffhausen, CH;
Chad William Morgan, Carneys Point, NJ (US);
Bruce Allen Champion, Camp Hill, PA (US);
David Patrick Orris, Middletown, PA (US);
Jessica H B. Hemond, Mifflintown, PA (US);
Megan Hoarfrost Beers, Redwood City, CA (US);
Aakriti Kharel, San Jose, CA (US);
Jason Thomas Chiota, Redwood City, CA (US);
TE CONNECTIVITY SOLUTIONS GmbH, Schaffhausen, CH;
Abstract
An electrical connector assembly having a printed circuit board, signal wires, and an impedance mold. The signal wires transmit signals at a determined signal speed. The signal wires have ends which are connected to the printed circuit board. The impedance mold cooperates with the printed circuit and the signal wires. The impedance mold is formed from a tunable hot melt adhesive composition. A dielectric constant of the tunable hot melt adhesive composition is adjusted to be compatible with the desired signal performance characteristics of the signals transmitted over the signal wires to the printed circuit board.