The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Jan. 20, 2023
Applicant:
Japan Aviation Electronics Industry, Ltd., Tokyo, JP;
Inventor:
Tetsuya Komoto, Tokyo, JP;
Assignee:
Japan Aviation Electronics Industry, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/71 (2011.01); H01R 12/57 (2011.01); H01R 12/70 (2011.01); H01R 13/405 (2006.01); H01R 13/502 (2006.01); H01R 13/516 (2006.01); H01R 13/6594 (2011.01); H01R 12/55 (2011.01); H01R 12/73 (2011.01); H01R 13/40 (2006.01); H01R 13/504 (2006.01); H01R 13/518 (2006.01); H01R 13/648 (2006.01); H01R 13/658 (2011.01); H01R 13/6585 (2011.01);
U.S. Cl.
CPC ...
H01R 12/716 (2013.01); H01R 12/57 (2013.01); H01R 12/70 (2013.01); H01R 12/707 (2013.01); H01R 12/712 (2013.01); H01R 13/405 (2013.01); H01R 13/502 (2013.01); H01R 13/516 (2013.01); H01R 13/6594 (2013.01); H01R 12/55 (2013.01); H01R 12/7011 (2013.01); H01R 12/714 (2013.01); H01R 12/73 (2013.01); H01R 13/40 (2013.01); H01R 13/504 (2013.01); H01R 13/518 (2013.01); H01R 13/648 (2013.01); H01R 13/658 (2013.01); H01R 13/6585 (2013.01);
Abstract
A base includes a lower surface opposed to a lower board on which a receptacle is surface-mounted. The lower surface includes a solder connection part exposed toward the lower board without being covered with a housing so that it is soldered to a ground pattern of the lower board. This structure improves signal characteristics of a contact at low cost in a surface-mounting connector where the contact and the housing are integrated by insert molding. The signal characteristics of each conductive pattern are thereby improved at low cost.