The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Mar. 31, 2021
Texas Instruments Incorporated, Dallas, TX (US);
Jaimal Mallory Williamson, McKinney, TX (US);
Hiep Xuan Nguyen, Cedar Hill, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
In examples, a semiconductor package comprises a semiconductor die having a first surface on which circuitry is formed and a second surface opposite the first surface. The semiconductor package includes a mold compound, the second surface facing the mold compound. The mold compound covers the semiconductor die; a set of conductive vias exposed to a top surface of the mold compound and coupled to a metal layer in the package; a set of first conductive members vertically aligned with the semiconductor die and exposed to the top surface of the mold compound; and a set of second conductive members coupling at least some of the set of conductive vias to at least some of the set of first conductive members. The set of second conductive members is exposed to the top surface of the mold compound.