The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
May. 19, 2022
Applicant:
Innolux Corporation, Miao-Li County, TW;
Inventors:
Yi-Hung Lin, Miao-Li County, TW;
Chun-Hung Lai, Miao-Li County, TW;
Chun-Chin Fan, Miao-Li County, TW;
Assignee:
INNOLUX CORPORATION, Miao-Li County, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 24/13 (2013.01); H01L 21/6835 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/1182 (2013.01); H01L 2224/13021 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13149 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13157 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/13176 (2013.01); H01L 2224/1318 (2013.01); H01L 2224/13564 (2013.01); H01L 2224/13565 (2013.01); H01L 2224/13578 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/1369 (2013.01); H01L 2224/16238 (2013.01);
Abstract
An electronic device and a method for manufacturing the same are provided. The electronic device includes: a first insulating layer; a first metal bump disposed on the first insulating layer; and a second insulating layer disposed on the first metal bump, wherein the second insulating layer includes a first opening exposing a portion of the first metal bump, wherein a thickness of the first insulating layer is greater than a thickness of the second insulating layer.