The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Nov. 11, 2021
Applicant:
Toyobo Co., Ltd., Osaka, JP;
Inventors:
Tetsuo Okuyama, Otsu, JP;
Keisuke Matsuo, Otsu, JP;
Assignee:
TOYOBO CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/4857 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/09563 (2013.01);
Abstract
This method for producing a layered body includes: a step A for preparing a first layered body by layering a first resin film and a patterned metal layer; a step B for preparing a second resin film having indentations corresponding to the metal layer pattern; and a step C for mating the metal layer pattern and the indentations in the second resin film and bonding together the first layered body and second resin film.