The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Feb. 09, 2023
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Shota Hayashi, Nagaokakyo, JP;
Nobuaki Ogawa, Nagaokakyo, JP;
Yuki Asano, Nagaokakyo, JP;
Takanori Uejima, Nagaokakyo, JP;
Hiromichi Kitajima, Nagaokakyo, JP;
Takahiro Eguchi, Nagaokakyo, JP;
Kunitoshi Hanaoka, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto-fu, JP;
Abstract
A substrate has an upper main surface and a lower main surface arranged in an up-down direction. A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The sealing resin layer is provided on the upper main surface of the substrate, covers the metal member, the first electronic component, and the second electronic component, and has an upper surface. The shield is provided on the upper surface of the sealing resin layer so as to be connected to the upper end of the plate-shaped portion. The plate-shaped portion is inclined with respect to the up-down direction such that an upper end of the plate-shaped portion is located in front of a lower end of the plate-shaped portion.