The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Nov. 03, 2022
Nanya Technology Corporation, New Taipei, TW;
Wu-Der Yang, Taoyuan, TW;
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Abstract
A package structure includes a first substrate, a second substrate, a chip, a first wire and a second wire. The first substrate includes a top surface, a bottom surface, a window and a first conductive pad. The bottom surface of the first substrate is opposite to the top surface. The window communicates the top surface and the bottom surface. The first conductive pad is located over the bottom surface. The second substrate is located over the first substrate. The second substrate is spaced from the first substrate and includes a second conductive pad facing the top surface of the first substrate and exposed from the window. The chip is located over the second substrate. The first wire connects the first conductive pad to the second conductive pad. The second wire connects the second conductive pad to the third conductive pad.