The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Jul. 27, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 23/49811 (2013.01); H01L 23/49866 (2013.01); H01L 25/105 (2013.01); H01L 2225/107 (2013.01);
Abstract
A method for manufacturing a semiconductor package includes forming a pad pattern including a metal film on a semiconductor chip; forming an insulating layer covering the pad pattern and including an organic insulating material; and forming an opening exposing a surface of the metal film of the pad pattern by performing laser processing on the insulating layer, wherein, in forming the opening, a region to be plastically deformed on the metal film by the laser processing is formed.