The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Jun. 08, 2021
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Hiroyuki Masumoto, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 39/10 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/057 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/52 (2013.01); B29C 39/10 (2013.01); B29C 45/14 (2013.01); B29C 45/14196 (2013.01); H01L 21/565 (2013.01); H01L 23/057 (2013.01); H01L 23/31 (2013.01);
Abstract
A manufacturing method of an insert case for a semiconductor device includes: placing a terminal inside a mold and fixing a central portion of the terminal by bringing a slide core into contact with the central portion of the terminal; with the central portion of the terminal fixed by the slide core, filling an inside of the mold with resin to mold an insert case; and separating the slide core from the terminal and taking out the insert case from the mold.