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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12488985 B1

PDFFull Text
Date of Patent:
Dec. 02, 2025

Filed:

Jan. 27, 2023

Semiconductor laminate and method for manufacturing semiconductor laminate

Applicant:

Sumitomo Chemical Company, Limited, Tokyo, JP;

Inventors:

Shota Kaneki, Hitachi, JP;

Hajime Fujikura, Hitachi, JP;

Taichiro Konno, Hitachi, JP;

Takeshi Kimura, Hitachi, JP;

Assignee:

SUMITOMO CHEMICAL COMPANY, LIMITED, Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Yasser A Abdelaziez

Int. Cl.
CPC ...
H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02579 (2013.01); H01L 21/02458 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01S 2304/04 (2013.01);
Abstract

There is provided a semiconductor laminate, comprising: a substrate; and a p-type layer provided above the substrate and comprising a group III nitride containing Mg, wherein C concentration in the p-type layer is less than 5×10cm, O concentration in the p-type layer is less than 5×10cm, Si concentration in the p-type layer is less than 1×10cm, and F concentration in the p-type layer is 1×10cmor more.

Find Patent Forward Citations

Kaneki, Shota. (2025). Semiconductor laminate and method for manufacturing semiconductor laminate (U.S. Patent No. 12488985). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12488985

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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