The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Jan. 30, 2024
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Toshiki Gushi, Tokyo, JP;

Shogo Yamada, Tokyo, JP;

Tomoyuki Sasaki, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/00 (2006.01); G11C 5/08 (2006.01); G11C 11/16 (2006.01); H10B 61/00 (2023.01); H10N 50/10 (2023.01); H10N 50/80 (2023.01);
U.S. Cl.
CPC ...
G11C 5/08 (2013.01); G11C 11/161 (2013.01); G11C 11/1675 (2013.01); H10B 61/22 (2023.02); H10N 50/10 (2023.02); H10N 50/80 (2023.02);
Abstract

A magnetic domain wall motion element includes a first ferromagnetic layer, in-plane wiring, and first, second and third via wirings. A position of the in-plane wiring in a stacking direction is different from that of the first ferromagnetic layer. The first via wiring connects the first ferromagnetic layer and in-plane wiring. The second via wiring is connected to the in-plane wiring at a different position from the first. The third via wiring is connected to the in-plane wiring at a different position from the first and second. When positions of the second and the third via wirings are projected on an axis passing through a center of the first via wiring when viewed in the stacking direction and extending in a second direction, the first via wiring is interposed between projection points of the second and third via wirings to the axis in the second direction.


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