The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Oct. 03, 2019
3m Innovative Properties Company, St. Paul, MN (US);
Brian E. Brooks, St. Paul, MN (US);
Gilles J. Benoit, Minneapolis, MN (US);
Peter O. Olson, Andover, MN (US);
Tyler W. Olson, Woodbury, MN (US);
Himanshu Nayar, St. Paul, MN (US);
Frederick J. Arsenault, Stillwater, MN (US);
Nicholas A. Johnson, Burnsville, MN (US);
Vincent J. Laraia, Houlton, WI (US);
Don V. West, St. Paul, MN (US);
3M Innovative Properties Company, St. Paul, MN (US);
Abstract
Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for optimizing a process of polishing semiconductor wafers. In one aspect, the method comprises repeatedly performing the following: i) selecting a configuration of input settings for polishing a semiconductor wafer, based on a causal model that measures current causal relationships between input settings and a quality of semiconductor wafers; ii) receiving a measure of the quality of the semiconductor wafer polished with the configuration of input settings; and iii) adjusting, based on the measure of the quality of the semiconductor wafer polished with the configuration of input settings, the causal model.