The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
May. 26, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Seyoung Park, Hwaseong-si, KR;
Gwangnae Gil, Yongin-si, KR;
Sola Woo, Suwon-si, KR;
Jonghyun Lee, Hwaseong-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2020.01); G06N 20/00 (2019.01); G01R 31/28 (2006.01); G01R 31/3183 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2601 (2013.01); G06N 20/00 (2019.01); G01R 31/28 (2013.01); G01R 31/2832 (2013.01); G01R 31/318357 (2013.01);
Abstract
A method of operating an electrical test prediction apparatus includes determining a relationship between first electrical test (ET) data, corresponding to at least one shot region comprising a subset of a plurality of semiconductor chips of a wafer, and electrical die sorting (EDS) data, obtained by measuring a state of each chip on the wafer by a testing device, and predicting second ET data, corresponding to an region of the wafer other than the at least one shot region by performing machine learning on the relationship.