The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Jan. 21, 2021
Applicant:

Yamaha Robotics Co., Ltd., Tokyo, JP;

Inventors:

Hiroshi Munakata, Tokyo, JP;

Michael Kirkby, Tokyo, JP;

Takuya Adachi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/24 (2006.01); G01N 29/04 (2006.01); G01N 29/22 (2006.01);
U.S. Cl.
CPC ...
G01N 29/2418 (2013.01); G01N 29/041 (2013.01); G01N 29/223 (2013.01); G01N 2291/0231 (2013.01); G01N 2291/0289 (2013.01); G01N 2291/104 (2013.01);
Abstract

A defect detection device () that detects defects in a semiconductor device () comprises ultrasonic speakers () that ultrasonically vibrate the semiconductor device (), a laser source () that irradiates the semiconductor device () with collimated laser light (), a camera () that has an imaging element () which acquires images by imaging the semiconductor device () that has been irradiated with the collimated laser light (), and a detection unit () that detects defects in the semiconductor device () on the basis of the images picked up by the camera (), wherein the detection unit () detects defects in the semiconductor device () on the basis of the deviation between images acquired by the camera () of the semiconductor device () when static and when ultrasonically vibrated.


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