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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12487038 B1

PDFFull Text
Date of Patent:
Dec. 02, 2025

Filed:

Mar. 24, 2022

Radiative cooling device

Applicant:

Osaka Gas Co., Ltd., Osaka, JP;

Inventors:

Masahiro Suemitsu, Osaka, JP;

Masayuki Sugimoto, Osaka, JP;

Assignee:

Osaka Gas Co., Ltd., Osaka, JP;

Attorney:

The Webb Law Firm

Primary Examiner:

Paul Alvare

Int. Cl.
CPC ...
F28F 13/18 (2006.01); B32B 7/023 (2019.01); B32B 7/12 (2006.01); B32B 15/085 (2006.01); B32B 27/20 (2006.01); B32B 27/22 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); F25B 23/00 (2006.01);
U.S. Cl.
CPC ...
F28F 13/18 (2013.01); B32B 7/023 (2019.01); B32B 7/12 (2013.01); B32B 15/085 (2013.01); B32B 27/20 (2013.01); B32B 27/22 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B32B 2307/416 (2013.01); B32B 2307/7376 (2023.05); F25B 23/003 (2013.01); F28F 2245/06 (2013.01);
Abstract

Provided is a radiative cooling device that is flexible, has increased weather resistance, and can be produced at a low cost. The radiative cooling device includes: an infrared radiative layer A having a radiative surface H for radiating infrared light IR; and a light reflective layer B on a side of the infrared radiative layer A, which is opposite to the radiative surface H. The infrared radiative layer A is a resin material layer J having a thickness adjusted so that the resin material layer emits heat radiation energy greater than absorbed solar energy in a wavelength range from 8 μm to 14 μm. The resin material layer J includes a vinyl chloride-based resin as a resin material in which a plasticizer is mixed. The plasticizer is any of phthalic acid esters, aliphatic dibasic acid esters, and phosphoric acid esters.

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