The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Jan. 23, 2021
Applicant:

The Regents of the University of Michigan, Ann Arbor, MI (US);

Inventors:

Tae H. Cho, Ann Arbor, MI (US);

Ellis Herman, Cambridge, MA (US);

Orlando Trejo, Ann Arbor, MI (US);

Mattison Rose, Ann Arbor, MI (US);

Lauren Ransohoff, Brookline, MA (US);

Neil Dasgupta, Ann Arbor, MI (US);

Kira Barton, Ann Arbor, MI (US);

Hyunwoo Park, San Diego, CA (US);

Andre Brooks, Southgate, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/52 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45551 (2013.01); C23C 16/45519 (2013.01); C23C 16/4585 (2013.01); C23C 16/52 (2013.01);
Abstract

A spatial atomic layer deposition apparatus that includes a depositor head having an active surface configured to discharge a flow of a first precursor gas, a flow of a second precursor gas, and a flow of an inert gas that separates the flow of the first precursor gas and the flow of the second precursor gas, a substrate plate that opposes the depositor head and has a support surface for retaining a build substrate, a plurality of gap detection sensors producing an output signal indicative of a distance between the active surface of the depositor head and the support surface of the substrate plate, and a controller that communicates with the plurality of gap detection sensors. The gap detection sensors permit a spatial orientation of the active surface of the depositor head and the support surface of the substrate plate to be determined in real-time and monitored.


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