The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Sep. 16, 2022
Applicants:

Plansee Shanghai High Performance Material Ltd., Shanghai, CN;

Plansee SE, Reutte, AT;

Plansee Japan Ltd., Tokyo, JP;

Inventors:

Chao Chen, Shanghai, CN;

Jiandong Lu, Shanghai, CN;

Christian Linke, Reutte, AT;

Tsutomu Kuniya, Kanagawa, JP;

Hennrik Schmidt, Reutte, AT;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3407 (2013.01);
Abstract

A sputtering target includes a tubular backing tube which has an axis which is defined as an axial direction, and a plane in which a radial direction lies is perpendicular to the axial direction. A cylindrical target segment is arranged on the tubular backing tube extends along the axial direction through at least 90% of length of the cylindrical target segment. A bonding material is arranged between the tubular backing tube and the target segment. The sputtering target includes a stop member for a target segment adjacent to the stop member, the stop member is monolithically formed with and radially protruding along the tubular backing tube at an axial end region of the tubular backing tube and extending along a part of a circumference of the tubular backing tube. A circumferential sealing member is inserted between the stop member and the target segment to prevent leakage of the bonding material.


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