The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Nov. 04, 2021
Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;
Kazuyoshi Yamamoto, Tokyo, JP;
Takahumi Mizuguchi, Tokyo, JP;
Eri Yoshizawa, Tokyo, JP;
Mao Takeda, Tokyo, JP;
NIPPON KAYAKU KABUSHIKI KAISHA, Tokyo, JP;
Abstract
Provided is a thermally curable resin composition which can give cured objects having low-dielectric characteristics, high heat resistance, a low modulus, and a low water absorption and which has satisfactory adhesiveness to substrates. The thermally curable resin composition comprises: a bismaleimide compound (A) including a constituent unit represented by formula (1) and containing maleimide groups at both ends of the molecular chain; a thermally curable resin or compound (B); and a polymerization initiator (C) and/or a curing accelerator (D).