The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Apr. 13, 2023
Applicant:

Moriroku Technology Company, Ltd., Tokyo, JP;

Inventor:

Toshihiko Horie, Tokyo, JP;

Assignee:

MORIROKU CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60K 35/00 (2024.01); B60K 35/23 (2024.01); B60K 35/231 (2024.01); B60K 37/00 (2024.01); B60R 13/04 (2006.01);
U.S. Cl.
CPC ...
B60R 13/04 (2013.01);
Abstract

A resin-molded article is fixed to and used on a plate-shaped member formed in a plate shape. The resin-molded article is such that an upper surface contact portion that is contactable with an upper surface of the plate-shaped member, an end surface contact portion that is contactable with an end surface of the plate-shaped member, and a lower surface contact portion that is formed separately from the end surface contact portion and that is contactable with a lower surface of the plate-shaped member are formed integrally with a body portion. It is preferable that an end portion contact surface of the end surface contact portion is disposed in substantially the same direction as the end surface of the plate-shaped member, the end portion contact surface being contactable with the end surface of the plate-shaped member.


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