The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Jun. 23, 2022
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Naoki Shishido, Shonai-Machi, JP;

Akira Kitahara, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29C 64/209 (2017.01); B29C 64/295 (2017.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B29C 64/209 (2017.08); B29C 64/295 (2017.08); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

A three-dimensional shaping apparatus includes: a discharge unit having a nozzle opening and configured to discharge a shaping material from the nozzle opening; a stage having a shaping surface supporting the shaping material discharged from the discharge unit; a sensor unit configured to detect the shaping material supported on the shaping surface; and a control unit configured to control the discharge unit to laminate the shaping material on the shaping surface, thereby shaping a three-dimensional shaped object. The control unit is configured to execute, before start of the shaping of the three-dimensional shaped object, a remaining detection step of detecting the shaping material remaining on the shaping surface by controlling the sensor unit.


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