The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

May. 25, 2023
Applicant:

Raytheon Technologies Corporation, Farmington, CT (US);

Inventors:

Masoud Anahid, Galena, OH (US);

Matthew E. Lynch, Canton, CT (US);

Malcolm P. Macdonald, Bloomfield, CT (US);

Ranadip Acharya, Glastonbury, CT (US);

Brian A. Fisher, West Hartford, CT (US);

Assignee:

RTX Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 50/02 (2015.01); B22F 10/28 (2021.01); B22F 10/37 (2021.01); B22F 10/85 (2021.01); B22F 12/58 (2021.01);
U.S. Cl.
CPC ...
B22F 10/85 (2021.01); B22F 10/28 (2021.01); B22F 10/37 (2021.01); B22F 12/58 (2021.01); B33Y 50/02 (2014.12);
Abstract

A process for uncertainty quantification for a predictive defect model for multi-laser additive manufacturing of a part including executing computational fluid dynamics modeling of a gas flow in an additive manufacturing machine manufacturing chamber; assigning a spatter particle size, velocity and direction relative to a melt pool on a powder bed disposed on a build plate within the manufacturing chamber; executing computational fluid dynamics post processing for spatter particle tracking; predicting a spatter particle landing pattern; feeding the spatter particle landing pattern prediction into a defect model; producing a layer thickness map, the layer thickness map configured to demonstrate a location of locally thicker layers on the part; and predicting defect location and density to accumulate lack-of-fusion risk as a function of part placement, orientation, and scan strategy.


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