The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Mar. 10, 2021
Applicant:

Kt&g Corporation, Daejeon, KR;

Inventors:

Dong Sung Kim, Seoul, KR;

Won Kyeong Lee, Gyeonggi-do, KR;

Heon Jun Jeong, Seoul, KR;

Jae Sung Choi, Gyeonggi-do, KR;

Assignee:

KT&G CORPORATION, Daejeon, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A24F 40/70 (2020.01); A24F 40/40 (2020.01); A24F 40/46 (2020.01); A24F 40/465 (2020.01); H05B 6/10 (2006.01); A24F 40/20 (2020.01); A24F 40/30 (2020.01); A24F 40/50 (2020.01);
U.S. Cl.
CPC ...
A24F 40/70 (2020.01); A24F 40/40 (2020.01); A24F 40/46 (2020.01); A24F 40/465 (2020.01); H05B 6/10 (2013.01); A24F 40/20 (2020.01); A24F 40/30 (2020.01); A24F 40/50 (2020.01); H05B 6/105 (2013.01);
Abstract

A method of manufacturing a heater module for an aerosol-generating device includes: preparing a heat transfer pipe having a hollow shape and including a thermal conductive material; forming an assembly of the heat transfer pipe and a cover by insert molding in which heat transfer pipe is placed in a mold and resin is injected into the mold, such that one end of the cover is integrally coupled to an end of the heat transfer pipe while a side wall of the cover is spaced apart from the heat transfer pipe and surrounds the heat transfer pipe; arranging a heater on an outer surface of the heat transfer pipe; and sealing, with a sealing stopper, a space between the heat transfer pipe and the cover such that internal pressure of the space is lower than atmospheric pressure.


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