The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Jun. 03, 2021
Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Naoki Watanabe, Tokyo, JP;

Yuan Bu, Tokyo, JP;

Assignee:

HITACHI, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/13 (2025.01); H01L 21/268 (2006.01); H10D 12/01 (2025.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H10D 62/137 (2025.01); H01L 21/268 (2013.01); H10D 12/01 (2025.01); H10D 62/133 (2025.01); H10D 62/8325 (2025.01);
Abstract

To realize a highly reliable IGBT that suppresses the bipolar degradation by preventing the occurrence of a defect on a boundary between a contact region and a silicide layer. As a means to realize the above, a semiconductor device includes: a collector region that is formed on a lower surface of a semiconductor substrate and forms an IGBT; and a collector electrode that is formed on a lower surface of the collector region via a silicide layer. The collector region and the silicide layer contains aluminum, first metal being more easily bondable to silicon than aluminum, and second metal being more easily bondable to carbon than aluminum.


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