The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Oct. 26, 2023
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Kotaro Shibata, Kyoto, JP;

Masaaki Matsuo, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/68 (2006.01); H01L 23/00 (2006.01); H01L 23/64 (2006.01); H01L 25/07 (2006.01); H03K 17/687 (2006.01);
U.S. Cl.
CPC ...
H03K 17/6871 (2013.01); H01L 23/645 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/13091 (2013.01); H03K 2217/009 (2013.01);
Abstract

A semiconductor device includes first semiconductor elements, a control terminal, a first conductive member, and first circuit components. The first semiconductor elements are connected in parallel, and a switching operation of each first semiconductor element is controlled according to a first drive signal inputted to a third electrode of each first semiconductor element. The first conductive member is electrically connected to the control terminal to which the first drive signal is inputted, and is electrically interposed between the third electrodes. The first conductive member includes connecting members and a portion of a signal wiring section. Each of the first circuit components increases an impedance in a first frequency band. The first frequency band includes a resonance frequency of a resonance circuit that is formed by including a parasitic inductance of the first conductive member. The third electrodes of the first semiconductor elements are electrically connected to each other via at least one of the first circuit components.


Find Patent Forward Citations

Loading…