The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Jul. 12, 2021
Applicant:

Inviza Llc, Austin, TX (US);

Inventors:

Robert G. Andosca, Boston, MA (US);

Todd Richard Christenson, Albuquerque, NM (US);

Marcus Taylor, Uppsala, SE;

Assignee:

Inviza Corporation, Cambridge, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02N 2/18 (2006.01); A43B 13/28 (2006.01); H01L 41/04 (2006.01); H01L 41/08 (2006.01); H01L 41/187 (2006.01); H01L 41/193 (2006.01); H01L 41/39 (2013.01); H01L 41/45 (2013.01); H10N 30/00 (2023.01); H10N 30/093 (2023.01); H10N 30/098 (2023.01); H10N 30/80 (2023.01); H10N 30/853 (2023.01); H10N 30/857 (2023.01);
U.S. Cl.
CPC ...
H02N 2/188 (2013.01); A43B 13/28 (2013.01); H02N 2/181 (2013.01); H10N 30/093 (2023.02); H10N 30/098 (2023.02); H10N 30/101 (2024.05); H10N 30/802 (2023.02); H10N 30/853 (2023.02); H10N 30/8554 (2023.02); H10N 30/857 (2023.02);
Abstract

Systems methods, and structures are provided that scavenge mechanical energy to provide electrical energy to a wearable, where the mechanical energy is scavenged by a bending-strain-based transducer that includes a non-resonant energy harvester. The bending-strain-based transducer also includes a sensor and/or a haptic device. The transducer may comprise a piezoelectric layer comprising a low-K piezoelectric material, such as aluminum nitride, which enables generation of higher voltage and power/energy output and/or a thinner transducer. Transducers in accordance with the present disclosure can be included in wearables for which large transducer thickness would be problematic, such as shoe insoles, midsoles or outsoles, garments, bras, handbags, backpacks, and the like.


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