The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Oct. 21, 2022
Applicant:

Japan Aviation Electronics Industry, Limited, Tokyo, JP;

Inventor:

Kentaro Toda, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01R 12/73 (2011.01); H01R 13/66 (2006.01);
U.S. Cl.
CPC ...
H01R 12/732 (2013.01); H01L 23/13 (2013.01); H01L 23/49805 (2013.01); H01R 13/665 (2013.01); H05K 1/142 (2013.01); H05K 2201/049 (2013.01); H05K 2201/10378 (2013.01);
Abstract

An assembly comprises a circuit board structure and a plurality of connection portions. The circuit board structure has a main circuit board and a supplemental circuit board. The main circuit board is formed with an accommodating portion. The accommodating portion is recessed downward in an up-down direction from an upper surface of the main circuit board. The main circuit board has a plurality of upper main conductive portions which are formed on the upper surface of the main circuit board. The supplemental circuit board has a plurality of upper supplemental conductive portions which are formed on an upper surface of the supplemental circuit board. The supplemental circuit board is, at least in part, accommodated in the accommodating portion. Each of ones of the connection portions connects a respective one of the upper main conductive portions and a respective one of the upper supplemental conductive portions with each other.


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