The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Sep. 13, 2022
Applicant:
Nanya Technology Corporation, New Taipei, TW;
Inventor:
Wu-Der Yang, Taoyuan, TW;
Assignee:
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H10D 1/68 (2025.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 24/48 (2013.01); H10D 1/692 (2025.01); H01L 2224/48139 (2013.01); H01L 2224/48147 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/1205 (2013.01);
Abstract
A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, a decoupling capacitor structure, and an electronic component. The decoupling capacitor structure is disposed on the substrate. The electronic component is disposed on the decoupling capacitor structure and electrically connected to the decoupling capacitor structure. The electronic component is stacked over the decoupling capacitor structure.