The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Aug. 21, 2020
Applicant:

Dynax Semiconductor, Inc., Kunshan, CN;

Inventors:

Xin Liu, Kunshan, CN;

Shuyu Yan, Kunshan, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 25/16 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 25/16 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/48195 (2013.01); H01L 2924/1421 (2013.01);
Abstract

An embodiment of the present disclosure provides a new integrated package electronic device structure, including a packaging component, including a packaging frame and a packaging substrate, and at least two circuit modules, being packaged on one side of the packaging substrate within the packaging frame, wherein the packaging frame including a merge point for the at least two circuit modules. In the present disclosure, by setting the merge points of at least two circuits packaged within the packaging frame on the packaging frame, the problem of occupying a large area when the integrated electronic device is applied due to setting the merge points on the packaging substrate is avoided, the utilization rate of the integrated electronic device is improved, and the integration and industrialization of the electronic device is facilitated.


Find Patent Forward Citations

Loading…