The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Nov. 10, 2022
Qorvo Us, Inc., Greensboro, NC (US);
Tobias Mangold, Huglfing, DE;
Qorvo US, Inc., Greensboro, NC (US);
Abstract
The present disclosure relates to a module package with a shielded module and a process for making the same. The disclosed shielded module includes a module board, at least one flip-chip die attached to the module board, a mold compound with at least one via hole, and a shielding structure. The mold compound resides over the module board to partially encapsulate the at least one flip-chip die, where the at least one via hole extends vertically from a top surface of the mold compound to a top surface of the at least one flip-chip die. The shielding structure completely covers surfaces within the at least one via hole and extends over the top surface and side surfaces of the mold compound. Herein, the shielding structure is conductive and in contact with the top surface of the at least one flip-chip die.