The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Aug. 18, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Soonkyu Hwang, Asan-si, KR;
Jinyeol Yang, Cheonan-si, KR;
Haegu Lee, Anyang-si, KR;
Jae-Min Jeon, Asan-si, KR;
Jin Hee Han, Asan-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
Disclosed are semiconductor inspection apparatuses, systems, and methods. The semiconductor inspection method comprises heating a top surface of a semiconductor package, capturing the top surface of the heated semiconductor package to obtain thermal image data, and analyzing the thermal image data. The analyzing the thermal image data includes analyzing first thermal image data about the top surface at a first region of the semiconductor package, and analyzing second thermal image data about the top surface at a second region of the semiconductor package. The analyzing the first thermal image data includes obtaining first region data about temperature distribution at the top surface of the first region, and using the first region data to obtain thickness data of a cover molding layer about thickness distribution of the molding layer on the chip in the first region.