The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Aug. 27, 2022
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventor:
Takashi Watanabe, Yokkaichi Mie, JP;
Assignee:
Kioxia Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/463 (2006.01); B24B 1/00 (2006.01); H01L 21/477 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/463 (2013.01); B24B 1/00 (2013.01); H01L 21/477 (2013.01); H01L 21/67103 (2013.01); H01L 21/67115 (2013.01);
Abstract
A semiconductor manufacturing apparatus is a semiconductor manufacturing apparatus for holding a polishing object on a polishing head and polishing a surface of the polishing object. The semiconductor manufacturing apparatus includes a plurality of laser irradiation parts on the polishing head. At least one of the laser irradiation parts is a laser irradiation part configured to radiate a laser beam toward the back surface side of the polishing object.