The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Mar. 02, 2023
Applicant:
Brewer Science, Inc., Rolla, MO (US);
Inventors:
Assignee:
Brewer Science, Inc., Rolla, MO (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); C08F 265/04 (2006.01); C09D 163/04 (2006.01); H01L 21/02 (2006.01); H01L 21/308 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0276 (2013.01); C08F 265/04 (2013.01); C09D 163/04 (2013.01); H01L 21/02164 (2013.01); H01L 21/02186 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01); H01L 21/31144 (2013.01); H01L 21/31111 (2013.01); H01L 21/31133 (2013.01);
Abstract
Adhesive additives are disclosed that enhance spin-on carbon (SOC) resistance to SC-1 wet etch. The additives can be formed by reacting a polymer or oligomer (such as an adhesion polymer or adhesion oligomer) with 3,4,5-triacetoxybenzoic acid (TABA). When added to standard SOC layers or used as a primer between an SOC layer and substrate, these additives enhance the adhesion of the SOC layer to TiN and other substrates and reduce undercut during SC-1 wet etch.