The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Jun. 09, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

David Peterson, San Jose, CA (US);

David Coumou, Webster, NY (US);

Chuang-Chia Lin, San Ramon, CA (US);

Kelvin Chan, San Ramon, CA (US);

Farzad Houshmand, Mountain View, CA (US);

Ping-Hwa Hsieh, Milpitas, CA (US);

Kristopher Ford, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32917 (2013.01); H01J 37/32935 (2013.01); H01J 2237/24507 (2013.01);
Abstract

Embodiments disclosed herein include a module, comprising: a substrate, wherein the substrate comprises a dielectric material, and a microstrip resonator on the substrate. In an embodiment, a microstrip transmission line is on the substrate adjacent to the microstrip resonator, and the microstrip resonator is spaced from the microstrip transmission line by a gap. In an embodiment, a ground plane on a surface of the substrate is opposite from the microstrip resonator.


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