The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Mar. 16, 2023
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Kota Zenzai, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A method for manufacturing a ceramic electronic chip including an outer electrode including a glass-free sintered layer containing no glass. The method includes providing a glass-free conductive paste including a conductive metal powder and a thermosetting resin, the conductive metal powder including an alloy of tin and at least one of copper and nickel, and the glass-free conductive paste containing no glass, and applying this composition to cover a portion of a surface of a ceramic body. Then the ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature of about° C., higher than or equal to a temperature about° C. higher than the curing temperature of the thermosetting resin. By the heat treatment, little of the thermosetting resin remains, and the conductive metal powder is sintered to form a unified sintered metal body.