The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Sep. 24, 2022
Applicant:

Metaland Llc, Doral, FL (US);

Inventors:

David Finn, Fussen Weissensee, DE;

Darren Molloy, Killour, IE;

Daniel Pierrard, Killour, IE;

Assignee:

Metaland LLC, Doral, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01); B41M 5/24 (2006.01); B41M 7/00 (2006.01); G06K 1/12 (2006.01);
U.S. Cl.
CPC ...
G06K 1/12 (2013.01); B41M 5/24 (2013.01); B41M 7/0036 (2013.01);
Abstract

A method of making a smartcard may comprise: providing a metal layer (ML) having a module opening (MO) extending from a front surface of the metal layer to a rear surface thereof; providing a sacrificial layer (SL) on the front surface of the metal layer; filling (from behind) the module opening with thermosetting resin (TR); allowing the thermosetting resin to cure (harden); removing the sacrificial layer; and from the front surface of the metal layer, milling a cavity in the cured (hardened) thermosetting resin for receiving a transponder chip module (TCM). A chip module may be implanted in the milled-out cavity, wherein the thermosetting resin provides mechanical support to the chip module and electrical insulation of the chip module from the metal layer. The smartcard may be 'dual-interface'.


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