The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Mar. 01, 2022
Boe Technology Group Co., Ltd., Beijing, CN;
Xing Li, Beijing, CN;
Ruize Li, Beijing, CN;
Hao Tang, Beijing, CN;
Ronghua Lan, Beijing, CN;
Jiuyang Cheng, Beijing, CN;
Meng Guo, Beijing, CN;
Zhihui Yang, Beijing, CN;
Qing Zhang, Beijing, CN;
Xuehui Zhu, Beijing, CN;
Quanguo Zhou, Beijing, CN;
Lijia Zhou, Beijing, CN;
Yong Qiao, Beijing, CN;
Zhong Huang, Beijing, CN;
Lirong Xu, Beijing, CN;
Beijing BOE Technology Development Co., Ltd., Beijing, CN;
Abstract
A curved substrate bubble detection method includes: providing, by a first light source and a second light source, parallel light incident to a to-be-tested substrate in different incident directions; obtaining, by a linear array camera, a first image including image information of a first side edge of the to-be-tested substrate; determining location information of a defect region of the to-be-tested substrate according to the first image, and generating a second image including image information of the defect region; binarizing the second image, and determining that the to-be-tested substrate has a bubble defect if there are at least two bright spots in an obtained binarized image, and a distance between any two first bright spots of at least two first bright spots is less than a first preset value. A curved substrate bubble detection system is also disclosed.