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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12480027 B1

PDFFull Text
Date of Patent:
Nov. 25, 2025

Filed:

Mar. 18, 2020

Curable silicone composition, cured product of same, and method for producing same

Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventor:

Ryosuke Yamazaki, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:

WARNER NORCROSS + JUDD LLP

Primary Examiner:

Liam J Heincer

Int. Cl.
CPC ...
C09J 183/04 (2006.01); B29C 43/00 (2006.01); B29C 43/24 (2006.01); B29C 43/28 (2006.01); B29C 43/30 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B29K 83/00 (2006.01); B29L 7/00 (2006.01); B29L 31/34 (2006.01); C08L 83/04 (2006.01); C09J 5/06 (2006.01); C09J 7/35 (2018.01); C09J 11/04 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C09J 183/04 (2013.01); B29C 43/003 (2013.01); B29C 43/24 (2013.01); B29C 43/28 (2013.01); B29C 43/305 (2013.01); B29C 45/0001 (2013.01); B29C 45/14336 (2013.01); C08L 83/04 (2013.01); C09J 5/06 (2013.01); C09J 7/35 (2018.01); C09J 11/04 (2013.01); B29K 2083/00 (2013.01); B29L 2007/002 (2013.01); B29L 2031/34 (2013.01); C08L 2203/20 (2013.01); C08L 2205/035 (2013.01); C09J 2203/326 (2013.01); C09J 2400/10 (2013.01); C09J 2483/00 (2013.01); H01L 23/296 (2013.01);
Abstract

Provided is a curable silicone composition and uses thereof. The composition has hot-melt properties, strongly adheres to poorly adhesive substrates, and is particularly superior in flexibility and toughness at high temperatures from room temperature to approximately 150° C. in cured products such as overmolding, in addition to providing a cured product that does not easily warp or become damaged even when integrally molded with a lead frame or the like. The composition comprises: (A) organopolysiloxane resin microparticles where 20 mol % or more of all siloxane units is siloxane units represented by RSiOwhere R is a monovalent hydrocarbon group; (B) a silatrane derivative or a carbasilatrane derivative; (C) a curing agent; and (D) a functional inorganic filler. The content of component (D) is 50% or more by volume relative to the overall composition. The composition is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower.

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