The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Jan. 18, 2023
Applicant:

Dexerials Corporation, Shimotsuke, JP;

Inventors:

Daisuke Sato, Utsunomiya, JP;

Yasushi Akutsu, Utsunomiya, JP;

Ryousuke Odaka, Tokyo, JP;

Yusuke Tanaka, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 7/10 (2018.01); C09J 11/04 (2006.01); C09J 163/00 (2006.01); H01B 1/22 (2006.01); H01R 4/04 (2006.01); H04N 23/54 (2023.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H10F 39/00 (2025.01); C08K 3/08 (2006.01); C08K 3/10 (2018.01); C08K 3/36 (2006.01); C08K 9/02 (2006.01); G03B 17/02 (2021.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 7/10 (2018.01); C09J 11/04 (2013.01); C09J 163/00 (2013.01); H01B 1/22 (2013.01); H01R 4/04 (2013.01); H04N 23/54 (2023.01); H05K 1/181 (2013.01); H05K 3/323 (2013.01); H10F 39/804 (2025.01); C08K 3/08 (2013.01); C08K 3/10 (2013.01); C08K 3/36 (2013.01); C08K 9/02 (2013.01); C08K 2201/001 (2013.01); C08K 2201/003 (2013.01); C09J 2203/326 (2013.01); C09J 2301/408 (2020.08); G03B 17/02 (2013.01); H01L 2224/48091 (2013.01); H05K 1/0269 (2013.01); H05K 1/0306 (2013.01); H05K 2201/09918 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01);
Abstract

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.


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