The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Aug. 06, 2021
Applicant:
Asahi Kasei Kabushiki Kaisha, Tokyo, JP;
Inventors:
Atsushi Yasumoto, Tokyo, JP;
Tsuneaki Konomoto, Tokyo, JP;
Hideki Yamasaki, Tokyo, JP;
Yoshifumi Araki, Tokyo, JP;
Assignee:
Asahi Kasei Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 81/26 (2006.01); B60C 1/00 (2006.01); C08L 21/00 (2006.01);
U.S. Cl.
CPC ...
C08L 21/00 (2013.01); B60C 1/0016 (2013.01); B65D 81/26 (2013.01); C08L 2312/00 (2013.01);
Abstract
A packaged molded article containing: a molded article of a rubber-like polymer having a weight average molecular weight of 100,000 or more, and a packaging film packaging the molded article, wherein a portion facing the molded article, of the packaging film, satisfies the following conditions (1) and (2): <Condition (1)> the portion has 50 or more openings; <Condition (2)> a total area ratio of the openings is 0.1% or more and 15% or less with respect to a total area of the portion facing the molded article.