The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Jun. 23, 2022
Applicant:

Sanden Corporation, Gunma, JP;

Inventors:

Nobutaka Shimizu, Gunma, JP;

Osamu Takazawa, Gunma, JP;

Ryo Miyakoshi, Gunma, JP;

Wataru Iwazaki, Gunma, JP;

Masaaki Sato, Gunma, JP;

Assignee:

SANDEN CORPORATION, Gunma, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60H 1/00 (2006.01);
U.S. Cl.
CPC ...
B60H 1/00978 (2013.01); B60H 1/00914 (2013.01); B60H 2001/00928 (2013.01); B60H 2001/00935 (2013.01); B60H 2001/00942 (2013.01); B60H 2001/00949 (2013.01);
Abstract

A heat medium temperature adjustment system includes a heat medium circuit configured to circulate heat medium having a temperature controlled by a heat exchange with a heat source. The heat medium circuit includes a pump configured to pump the heat medium, and a plurality of heat exchangers for temperature-adjustment subjects configured to perform heat exchanges with temperature-adjustment subjects. The heat medium circuit is configured to form a series flow path to connect the pump to the plurality of heat exchangers for temperature-adjustment subjects when a system malfunction occurs.


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