The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Jun. 02, 2023
Ykk Ap Inc., Tokyo, JP;
Isao Kobayashi, Tokyo, JP;
Koji Matsuda, Tokyo, JP;
YKK AP Inc., Tokyo, JP;
Abstract
Provided is a resin profile joining method of joining a pair of resin profiles. The method includes: holding one resin profile and another resin profile of the pair of resin profiles with a first mold and a second mold, respectively; heating the end surfaces of the pair of resin profiles in no contact with the end surfaces of the pair of resin profiles to melt the pair of resin profiles; after the heating, moving each of the first mold and the second mold relative to the pair of resin profiles in a longitudinal direction of a corresponding resin profile of the pair of resin profiles; and crimping the end surfaces of the pair of resin profiles to each other while keeping the first mold and the second mold in contact with the surfaces of the pair of resin profiles.