The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Feb. 21, 2024
Applicant:

Textron Aviation Inc., Wichita, KS (US);

Inventors:

Ron Tozier, Andover, KS (US);

Kyra Rubinstein, Wichita, KS (US);

Ryan Binter, Wichita, KS (US);

Assignee:

Textron Innovations Inc., Providence, RI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/00 (2017.01); B29C 64/118 (2017.01); B29C 64/209 (2017.01); B29C 64/232 (2017.01); B29C 64/241 (2017.01); B29C 64/245 (2017.01); B29C 64/25 (2017.01); B29C 64/336 (2017.01); B29C 64/35 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B29C 64/236 (2017.01);
U.S. Cl.
CPC ...
B29C 64/245 (2017.08); B29C 64/118 (2017.08); B29C 64/209 (2017.08); B29C 64/232 (2017.08); B29C 64/241 (2017.08); B29C 64/25 (2017.08); B29C 64/336 (2017.08); B29C 64/35 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B29C 64/236 (2017.08);
Abstract

Disclosed is a heated printer bed mounted to a kinematic coupling system that permits thermal expansion of both the bed and a support truss. One kinematic couple couples the bed to the support truss and a second kinematic couple couples the support truss to a frame of the printer. Both kinematic couples ensure that a common geometric center along each kinematic couple is maintained despite thermal expansion of the printer bed and the support truss occurring at different rates. The kinematic coupling system mitigates deformations to 3D-printed items from the effects of thermal expansion.


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