The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

May. 26, 2022
Applicant:

Aptiv Technologies Ag, Schaffhausen, CH;

Inventors:

David R. Peterson, Aurora, OH (US);

Joseph Sudik, Jr., Niles, OH (US);

Jonathan D. Weidner, Conneautville, PA (US);

Sean P. Krompegel, Canfield, OH (US);

Jared Bilas, North Bloomfield, OH (US);

Assignee:

APTIV TECHNOLOGIES AG, Schaffhausen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29C 64/118 (2017.01); B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01); H01B 7/00 (2006.01); H01B 13/00 (2006.01); H01B 13/012 (2006.01); H01B 13/24 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B29C 64/118 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); H01B 7/0045 (2013.01); H01B 13/0003 (2013.01); H01B 13/01209 (2013.01); H01B 13/01236 (2013.01); H01B 13/01263 (2013.01); H01B 13/24 (2013.01); B29K 2995/0006 (2013.01); B29L 2031/3462 (2013.01);
Abstract

A wiring harness assembly includes a plurality of electrical conductors having wires enclosed within insulative sheaths that are integrally formed of an electrically insulative material. The assembly also includes a lattice support structure that is attached to the insulative sheaths at multiple locations. The lattice support structure is configured to maintain a desired shape of the assembly. The lattice support structure is formed of filaments that may be formed using an additive manufacturing process The filaments may be arranged such that lattice support structure defines a plurality of hexagonally shaped apertures. A process for manufacturing the wiring harness assembly and an apparatus configured to manufacture the wiring harness assembly is also presented.


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