The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Feb. 25, 2025
Applicant:

Imam Mohammad Ibn Saud Islamic University, Riyadh, SA;

Inventors:

Barun Haldar, Riyadh, SA;

Atul Singh Rajput, Mangaluru, IN;

Arpan Kumar Mondal, Kolkata, IN;

Naser A. Alsaleh, Riyadh, SA;

Nashmi H. Alrasheedi, Riyadh, SA;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 31/112 (2006.01); B24B 1/00 (2006.01);
U.S. Cl.
CPC ...
B24B 31/112 (2013.01); B24B 1/005 (2013.01);
Abstract

An apparatus and a polishing system for rotational magnetorheological abrasive flow nano-finishing are described. The apparatus includes an upper cylinder with coupled upper piston and a lower cylinder with coupled lower piston. A first motor drives synchronized reciprocating motion of both pistons via respective slider crank mechanisms. A magnet fixture positioned between the cylinders includes permanent magnets arranged in a ring configuration with a central hole for workpiece placement. A second motor rotates the magnet fixture to manipulate magnetic field orientation. The cylinders, pistons and magnet fixture define a space for containing magnetorheological (MR) fluid including ferromagnetic particles, abrasive particles and carrier fluid. The configuration enables controlled fluid flow through the hole while maintaining direct workpiece contact, with ferromagnetic particles exhibiting both rotational and reciprocal movement patterns. This dual-motion finishing approach enables material removal through magnetic field-controlled abrasive action, achieving nano-scale surface quality on complex geometries.


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