The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Sep. 13, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jongho Lim, Suwon-si, KR;

Jaehyuk Lim, Hwaseong-si, KR;

Hosik Jun, Hwaseong-si, KR;

Hyojeong Kang, Hwaseong-si, KR;

Yonggi Cho, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/856 (2025.01); H01L 25/16 (2023.01); H10H 20/01 (2025.01); H10H 20/851 (2025.01); H10H 20/855 (2025.01);
U.S. Cl.
CPC ...
H10H 20/856 (2025.01); H01L 25/167 (2013.01); H10H 20/01 (2025.01); H10H 20/851 (2025.01); H10H 20/855 (2025.01); H10H 20/0361 (2025.01); H10H 20/0363 (2025.01);
Abstract

A light-emitting diode (LED) package includes a substrate including an insulating material; upper pads on an upper surface of the substrate; a side surface molding layer covering the upper surface of the substrate and side surfaces of the upper pads; an LED chip on the upper surface of the substrate and electrically connected to the upper pads; a fluorescent layer on the LED chip; and a reflection molding layer on the substrate and covering the LED chip, the reflection molding layer including white silicon, wherein the reflection molding layer exposes a portion of side surfaces of the fluorescent layer.


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