The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Mar. 08, 2023
Applicant:

Semiconductor Components Industries, Llc, Scottsdale, AZ (US);

Inventors:

Nicholas Paul Cowley, Wroughton, GB;

Andrew David Talbot, Chieveley, GB;

Stephen James Spinks, Shrivenham, GB;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H04N 25/633 (2023.01); H04N 25/702 (2023.01); H04N 25/703 (2023.01); H04N 25/78 (2023.01); H10F 39/18 (2025.01);
U.S. Cl.
CPC ...
H10F 39/811 (2025.01); H04N 25/702 (2023.01); H04N 25/703 (2023.01); H04N 25/78 (2023.01); H10F 39/182 (2025.01); H04N 25/633 (2023.01);
Abstract

An image sensor may include an image sensor pixel array. The image sensor pixel array may include active image sensor pixels and non-active image sensor pixels. A line of peripheral image sensor pixels may be coupled to a corresponding interconnect structure via a pixel signal path. The pixel signal path may include portions that overlap pass-through pixels and a keep-out region beyond an edge of the image sensor pixel array. Multiple interconnect structures may connect the image sensor pixel array implemented on a first integrated circuit die to pixel control and readout circuitry on a second integrated circuit die.


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