The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
May. 01, 2024
Applicant:
Infineon Technologies Dresden Gmbh & Co. KG, Dresden, DE;
Inventors:
Dirk Meinhold, Dresden, DE;
Steffen Bieselt, Wehlen, DE;
Assignee:
Infineon Technologies Dresden GmbH & Co. KG, Dresden, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 86/00 (2025.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H10D 86/201 (2025.01); H01L 21/02422 (2013.01); H01L 21/02554 (2013.01); H01L 21/02595 (2013.01);
Abstract
A semiconductor component includes: a silicon-based substrate; an oxide layer atop the silicon-based substrate; an electronic component based on polycrystalline silicon; a crystalline silicon layer atop the silicon-based substrate and atop lateral faces of the oxide layer; and a lid connected to the crystalline silicon layer. The lid is a glass-based lid, a quartz-based lid or a silicon-based lid.