The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Dec. 10, 2020
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Frédéric Voiron, Barraux, FR;
Larry Buffle, Caen, FR;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 1/68 (2025.01); H01L 21/302 (2006.01); H01L 21/3213 (2006.01); H10D 1/66 (2025.01); H10D 89/10 (2025.01);
U.S. Cl.
CPC ...
H10D 1/716 (2025.01); H01L 21/302 (2013.01); H01L 21/3213 (2013.01); H10D 1/66 (2025.01); H10D 89/10 (2025.01);
Abstract
A semiconductor structure that includes a protruding wall structure that extends from a base surface of a substrate. Corners of the protruding wall structure may be smoothed or rounded to reduce electrical stress within the structure. The protruding wall structure may be partitioned into multiple wall regions disposed along different directions of the substrate to reduce mechanical stress.