The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Jun. 14, 2022
Mitsubishi Electric Corporation, Tokyo, JP;
Yoshikazu Tsunoda, Tokyo, JP;
Takashi Kumagai, Tokyo, JP;
Tomohito Fukuda, Tokyo, JP;
Yuji Shirakata, Tokyo, JP;
Kenta Fujii, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A circuit device includes: a first heat sink having a first upper surface; a plurality of first partition plates and second partition plates attached to the first upper surface; a sealing material; a first circuit component; and a printed wiring board. A normal direction of the first upper surface is along a first direction. The first partition plates extend in a second direction orthogonal to the first direction. The second partition plates extend in a third direction orthogonal to the first direction and the second direction. The sealing material is made to fill a space defined by two adjacent first partition plates, two adjacent second partition plates, and the first upper surface. The first circuit component is disposed in the sealing material. The printed wiring board is disposed on the first partition plate and the second partition plate, and is electrically connected to the first circuit component.